結晶成長を始めとする工業的製造プロセスにおいて出現する金属および半導体の融体において,粘度は最も重要な性質の一つである.低粘度である金属系融体の粘度測定には回転振動法が最適であり,測定に与える種々の因子について詳述した.溶融金属および半導体の粘度は従来の様々な報告とは異なり,ほぼ全ての融体についてArrhenius型の温度依存性を満足した.金属系の場合は高融点のものほど高い粘度と活性化エネルギーを示すが,溶融半導体は高融点であっても低い値を示し,固体でのダイヤモンド型構造が原因と考えられる.

停滞前線ため何が動かない

また合金の粘度は対数加成則が基準となり,これよりの偏倚が成分間相互作用の寄与を表すものと考えられる.

As viscosity is the most fundamental physical property of the metallic liquids in most industrial processes, many efforts have been made to obtain the reliable and accurate values. In this paper, the detail in the actual viscosity measurement by using oscillating cylinder method for high temperature is described. It was made clear that to use the crucible with higher aspect ratio and the excellent temperature uniformity around the crucible are very important. The viscosities of most metals and semiconductors showed good Arrhenius linearity in discord with previous literature values.

どのように暖かいのですか？

The viscosities and the activation energies of molten metal generally increase with increasing their melting temperatures although molten semiconductors show considerably lower values than typical metals. Furthermore, it was proposed that primary dependence on the isothermal viscosity of mixture melt should be an additivity of logarithmic viscosity and the interaction between the components may be discussed on the deviation from the logarithmic additivity.

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